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Alumina Ceramic Substrate Sheet/PlateAlumina Ceramic Substrate Sheet is an ideal choice for applications requiring high performance, reliability, and durability. It is available in various sizes and thicknesses to suit different applications.
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YSZ Yttrium Stabilized Square / Round Zirconia Ceramic PlateZirconia plates are ceramic plates made from zirconium oxide, a material with a high strength-to-weight ratio and high temperature resistance.
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Aluminum Nitride WafersAlN wafers offers high thermal conductivity for thermal management application. A variety of specifications available. Satisfying various technical request.
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Square Aluminum Nitride SubstratesAlN substrates with lower medium spoilage, good insulation performance and high temperature resistance. A variety of sizes available. Satisfying various technical request.
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Customized Aluminum Nitride SheetsAluminum nitride substrates offers high electrical insulation for a variety of electrical uses. A variety of specifications available. Satisfying various machining request.
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Aluminum Oxide Metalized Substrate Ceramic Substrate DBC DPC ProcessedAlumina ceramic metalized substrates are ceramic copper-clad plates with electrical conductivity, thermal conductivity, and high insulation properties, formed by metalizing alumina ceramic substrates with copper.
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High Hardness ZTA Ceramic Substrate Wear Resistant ZTA SubstrateThe ZTA ceramic substrate, made of alumina & zirconia, is sintered at high temp, offering hardness, wear resistance, & toughness ideal for demanding apps.
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High-Power SiC Ceramic Substrate Conductive & Semi-Insulating TypesSiC substrate, basic material for semiconductor chips, in conductive & semi-insulating types, supports high-temp, high-voltage, large-power apps, available in 2-8 inches (50-200mm) diameters.
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High-Purity Si3N4 Ceramic Semiconductor Substrate for Power Devices & ICsThe Si3N4 ceramic substrate, a new-gen semiconductor material made of high-purity powder, is widely used in power components, inverters, modules, & multi-device ICs.
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High-Performance Metalized AlN Ceramic Substrate for HV/HP DevicesThe metalized aluminum nitride ceramic substrate is a versatile packaging solution for high-voltage, high-power devices in EVs, rail transit, smart grids, aerospace.
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AMB Metalized Si3N4 Ceramic Substrate for High-Power Device PackagingThe AMB silicon nitride substrate, offers electrical function, ideal for packaging high-voltage, high-power devices used in EVs, rail transit, smart grids, and aerospace.